How to remove composite material from memory chip?

[edbrandt]

Hi

What is the best way of removing hard composite materiale that covers the memory chip in some USB sticks?

Or is it possible to unsolder and read the chip without removing composite? (can't even see the chip)

Fil 11.08.2017, 14.34.19.jpeg (14.77 KiB) Viewed 8938 times

Thanks

-Espen

[jerema]

I think there is nothing what you can do. After removing the composite material, you will not found a solution to read the chip.
Maybee you can remove the carefully the pcb and found any know bga pins?

[edbrandt]

I did some more searching, it seems like it is epoxy resin and it can be removed using heat (100-120 degrees celcius)

https://www.youtube.com/watch?v=kTPXKA66baQ

I´ll give it a try in the morning

-Espen

[jerema]

Yes try it. Please inform us, if it was successfully.

[edbrandt]

Well... I guess I need some practice here.. It was not successfull, whatever was inside all cracked up, and the epoxy was just fine. I'll do some more testing later, just need to dig up some more memory sticks similar to this.

Btw.. this was ony for testing, no customer data

-Espen

[Roman_TS]

For such cases with glued NAND core, you have to:

1. Find pinout for controller that is used in Flash Storage;
2. Unsolder controller and capacitors from PCB. Use Spider Board or Circuit Board for dump reading though PCB contacts.

[edbrandt]

Thanks, that sounds logical. I'll try that.

-Espen

[antonvn]

I just want to come back to the black stuff used to cover the chip. It is a 'potting' agent used by the electronics fraternity to hide and protect their circuit. I have tried everything to dissolve it and I was unsuccessful. There is one thing that I have not tried, paint remover. Paint remover is quite amazing, I have found many uses for it.

Anyway, if anyone finds a way to dissolve the potting agent, let us know please.