We usually process cases starting from non-invasive solutions to invasive one - so if we have a damaged phone first attempt is to repair it, then JTAG, SPI or ISP reading, then ChipOff and then if controller is death NAND recovery from eMMC - this is our path.
Performing chip off as a first method is not a good way in my point of view as a first stage. Maybe its faster (no matter if we are talking by coold procedures using sanding/CNC PCB remove from bottom or hot remove using IR/hotair) but not always safe for data ..... what if if you will get disk encryption on Android and you will perform chip off ?? You will need to put back memory to phone. Ofcourse right now it's possible to crack FDE <=1.3 but it takes time and if it's higher then it will be not possible at all. If you use ISP (no matter if you will solder wires or use VR) you will see this very fast since you can scan partition of connected phone and it's GPT to see if UserData it's encrypted or not....

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